3D AOI
Xceed - New Generation 3D AOI
3D AOI Sensor Head (TRSC-I)
• High Speed CMOS Camera (4Mega-pixel) with Dual Laser Technology
• RGB LED Lights
• Telecentric Lens
• Light Weight, Compact Sensor Head Design
• Industry Leading Inspection Speed: 65 cm2/sec @ 14 x 14um
• Cycle Time: For PCB 260mm x 200mm = 10 seconds including load and unload
Intelligent detection: Not affected by PCB material, surface and color
• Dark PCB
• White PCB
• Chemical ceramic PCB
• Reflective parts
Real 3D image
• Advanced signal processing technology to show true and clear 3D images without any noise
Barcode and Bad Marker Scan Recognition
• In one inspection, both Barcode and Bad Mark are recognized simultaneously. 1D, 2D, QR Laser Marking, and Printing barcodes are recognizable.
All bad types can be detected
• Dimension, Missing, Misalignment (X/Y/Rotation), Wrong (Body), Side Mount, Tombstone, Text (OCV/OCR), Wrong (Matching), Solder Joint, Lead Offset, Bridge, Color band, Pin, Coplanarity, can be perfectly detected.
• High Speed CMOS Camera (4Mega-pixel) with Dual Laser Technology
• RGB LED Lights
• Telecentric Lens
• Light Weight, Compact Sensor Head Design
• Industry Leading Inspection Speed: 65 cm2/sec @ 14 x 14um
• Cycle Time: For PCB 260mm x 200mm = 10 seconds including load and unload
Intelligent detection: Not affected by PCB material, surface and color
• Dark PCB
• White PCB
• Chemical ceramic PCB
• Reflective parts
Real 3D image
• Advanced signal processing technology to show true and clear 3D images without any noise
Barcode and Bad Marker Scan Recognition
• In one inspection, both Barcode and Bad Mark are recognized simultaneously. 1D, 2D, QR Laser Marking, and Printing barcodes are recognizable.
All bad types can be detected
• Dimension, Missing, Misalignment (X/Y/Rotation), Wrong (Body), Side Mount, Tombstone, Text (OCV/OCR), Wrong (Matching), Solder Joint, Lead Offset, Bridge, Color band, Pin, Coplanarity, can be perfectly detected.
• Equipment Size (W x D x H): 850mm (W) × 1205mm (D) × 1525mm (H)
• Equipment Weight (kg): 750 kg
• Measuring Principle : Shadow Free Dual Laser Optical Triangulation
• Camera System : 4 Mega Pixel
• Light Source : R.G.B.W LED
• Scan Speed (cm2/sec) : 65 cm2/sec
• X-Y Resolution (um) : 14 x 14 um
• High Resolution : 0.4 um
• High Repeatability : 3б < 3um/Height
• High Accuracy : < 5um
• Inspection Type: Dimension, Missing, Misalignment (X/Y/Rotation), Wrong (Body), Side Mount, Tombstone, Text (OCV/OCR), Wrong (Matching), Solder Joint, Lead Offset, Bridge, Color band, Pin, Coplanarity
• PCB Warpage : ±5mm (2%)
• Barcode : 1D/2D/QR Barcode Inspection using TRSC-I
• Maximum Component Height : 40mm
• Equipment Weight (kg): 750 kg
• Measuring Principle : Shadow Free Dual Laser Optical Triangulation
• Camera System : 4 Mega Pixel
• Light Source : R.G.B.W LED
• Scan Speed (cm2/sec) : 65 cm2/sec
• X-Y Resolution (um) : 14 x 14 um
• High Resolution : 0.4 um
• High Repeatability : 3б < 3um/Height
• High Accuracy : < 5um
• Inspection Type: Dimension, Missing, Misalignment (X/Y/Rotation), Wrong (Body), Side Mount, Tombstone, Text (OCV/OCR), Wrong (Matching), Solder Joint, Lead Offset, Bridge, Color band, Pin, Coplanarity
• PCB Warpage : ±5mm (2%)
• Barcode : 1D/2D/QR Barcode Inspection using TRSC-I
• Maximum Component Height : 40mm