EFEM wafer conveyor
DWE300 series
● high degree of freedom: can be used for transmission of wafers or other processes
● Provide high productivity, high cleanliness, and higher reliability
● high integration of space-saving design, and high stability
● can be equipped with single, two arms, in response to customer needs
● loader / Unloader load port- can be 1 ~ 4port
● single / double discharge, single / double receipt in response to customer premises or U-shaped production line
• Selection of End Effector - depending on wafer size. Such as wafer size / wafer type / wafer thickness / wafer bending
● Provide high productivity, high cleanliness, and higher reliability
● high integration of space-saving design, and high stability
● can be equipped with single, two arms, in response to customer needs
● loader / Unloader load port- can be 1 ~ 4port
● single / double discharge, single / double receipt in response to customer premises or U-shaped production line
• Selection of End Effector - depending on wafer size. Such as wafer size / wafer type / wafer thickness / wafer bending
一、First, the edge of the machine Pre-aligner
Wafer size: 200 ~ 300mm positioning time: 3.5 seconds or less
Positioning accuracy: 1. Center of ± 0.2mm 2. Angle ± 0.2 degrees
Second, the mechanical arm
Using Hirata Robot, reliable quality
Repeatability
1. Lifting shaft (Z axis): ± 0.05 mm
2. Rotary axis (W axis): ± 0.03 °
3. Telescopic shaft (A / B axis): ± 0.05 mm
4. Rotation axis (R axis): ± 0.06 ° wafer bending
Wafer size: 200 ~ 300mm positioning time: 3.5 seconds or less
Positioning accuracy: 1. Center of ± 0.2mm 2. Angle ± 0.2 degrees
Second, the mechanical arm
Using Hirata Robot, reliable quality
Repeatability
1. Lifting shaft (Z axis): ± 0.05 mm
2. Rotary axis (W axis): ± 0.03 °
3. Telescopic shaft (A / B axis): ± 0.05 mm
4. Rotation axis (R axis): ± 0.06 ° wafer bending