3D SPI
SIGMA X – World Class 3D SPI
RSC-7 Laser Head
• Industry leading inspection speed
• 30% faster than RSC-6
• SIGMA X Orange : 100cm2/sec @ 10x10μm
• SIGMA X Blue : 60cm2/sec @ 10x10μm
Optimized Panel Transportation
• 1,000mm/sec of panel transportation
• Reduced loading/unloading time
• 4 seconds faster than HS60
Real 3D Images
• PARMI’s inspection technology is unaffected by varying materials, surface conditions or colors.
• The system profiles the board to generate accurate 3D shapes far superior to other brands and technologies.
Warpage Tracking in Real Time
• The system identifies total board warpage up to 10mm(±5mm) and the exclusive Z Axis motion control system maintains optimal depth of focus while measuring Warpage.
Dual Laser Projection
• Dual laser projection eliminates all shadowing and produces the highest level of measurement accuracy. Using a high frame.
• CMOS camera the system realizes the 3D shape of the entire board scanning area.
• Industry leading inspection speed
• 30% faster than RSC-6
• SIGMA X Orange : 100cm2/sec @ 10x10μm
• SIGMA X Blue : 60cm2/sec @ 10x10μm
Optimized Panel Transportation
• 1,000mm/sec of panel transportation
• Reduced loading/unloading time
• 4 seconds faster than HS60
Real 3D Images
• PARMI’s inspection technology is unaffected by varying materials, surface conditions or colors.
• The system profiles the board to generate accurate 3D shapes far superior to other brands and technologies.
Warpage Tracking in Real Time
• The system identifies total board warpage up to 10mm(±5mm) and the exclusive Z Axis motion control system maintains optimal depth of focus while measuring Warpage.
Dual Laser Projection
• Dual laser projection eliminates all shadowing and produces the highest level of measurement accuracy. Using a high frame.
• CMOS camera the system realizes the 3D shape of the entire board scanning area.
• Equipment Size (W x D x H): 850mm (W) × 1205mm (D) × 1510mm (H)
• Equipment Weight (kg): 800 kg
• Measuring Principle : Shadow Free Dual Laser Optical Triangulation
• Camera System : High Frame Rate C-MOS Sensor (4 Mega Pixel)
• Scan Speed (cm2/sec) : 60~100 cm2/sec
• X-Y Resolution (um) : 10 x 10 um
• High Resolution (um) : 0.1 um
• High Repeatability : 3б < 1mm, on a certification target
• High Accuracy : < 2um, on a certification target
• Inspection Type : Height, Area, Volume, Offset, Shape, Balance, Warpage, Shrink
• PCB Warpage : ±5mm (2%)
• Barcode : 1D/2D Barcode Inspection
• Max. Paste Height(um) : 1000um
• Equipment Weight (kg): 800 kg
• Measuring Principle : Shadow Free Dual Laser Optical Triangulation
• Camera System : High Frame Rate C-MOS Sensor (4 Mega Pixel)
• Scan Speed (cm2/sec) : 60~100 cm2/sec
• X-Y Resolution (um) : 10 x 10 um
• High Resolution (um) : 0.1 um
• High Repeatability : 3б < 1mm, on a certification target
• High Accuracy : < 2um, on a certification target
• Inspection Type : Height, Area, Volume, Offset, Shape, Balance, Warpage, Shrink
• PCB Warpage : ±5mm (2%)
• Barcode : 1D/2D Barcode Inspection
• Max. Paste Height(um) : 1000um