high-end 5D SPI system
ASMPT Process Lens HD
The Process Lens HD high-end 5D SPI system offers an unprecedented combination of speed and precision, and thanks to the use of powerful state-of-the-art algorithms, it understands exactly what it measures and knows how to interpret the results.
•Innovative: DLP chips with 20 million micromirrors ( HD version, respectively) produce absolutely distortion-free Moiré patterns
•Fast and reliable: Up to 70 percent shorter inspection times and up to 80 percent fewer false calls compared to traditional SPI systems.
•High precision: With a resolution of down to 10 µm, speed and precision are no longer mutually exclusive with the Process Lens.
•Measures what matters: The Process Lens measures paste deposits, glue, contamination, dust, and a whole lot more – all while suppressing any measurement noise generated by the PCB.
•Innovative: DLP chips with 20 million micromirrors ( HD version, respectively) produce absolutely distortion-free Moiré patterns
•Fast and reliable: Up to 70 percent shorter inspection times and up to 80 percent fewer false calls compared to traditional SPI systems.
•High precision: With a resolution of down to 10 µm, speed and precision are no longer mutually exclusive with the Process Lens.
•Measures what matters: The Process Lens measures paste deposits, glue, contamination, dust, and a whole lot more – all while suppressing any measurement noise generated by the PCB.
Machine dimensions :(W x D x H)：1,130 × 1,300 × 1600mm(H)
Height: (kg)：780 kg
DLP chip : 20 million micromirrors
Inspection speed: 90 cm²/s ;
X-YPixel size : 10 μm × 10 μm（High-resolution mode）20 μm × 20 μm（High-speed mode）
Vertical resolution : 0.37 um
Height accuracy with calibration target: : < 1um
Solder paste measurements : Volume、Area、Height、X Y offset、Shape、Bridging、Coplanarity
PCB Size: 50x50mm - 540 x 560mm
Maximum PCB warpage compensation range: ±6.5mm
Paste height (max) : 1000um
Height: (kg)：780 kg
DLP chip : 20 million micromirrors
Inspection speed: 90 cm²/s ;
X-YPixel size : 10 μm × 10 μm（High-resolution mode）20 μm × 20 μm（High-speed mode）
Vertical resolution : 0.37 um
Height accuracy with calibration target: : < 1um
Solder paste measurements : Volume、Area、Height、X Y offset、Shape、Bridging、Coplanarity
PCB Size: 50x50mm - 540 x 560mm
Maximum PCB warpage compensation range: ±6.5mm
Paste height (max) : 1000um