RFA300

.Low consumption:
N2 consumption only 1 of 50 traditional reflow furnace
Power consumption is only 30% traditional reflow furnace
.Hot air reflow at the backside of wafer - frontside solder ball won't shift
.The oxygen content in the furnace is controlled below 50 ppm
.The standby state does not need to waste nitrogen and reduce vacant waste
.Support lower pressure after reflow, reduce the formation of VOID
.Wafer surface temperature tolerance +/- 2. C or less