X-Ray CT inspection system
OMRON VT-X750
The X750 is used for non-destructive inspection of 5G infrastructure/modules and in-vehicle electrical components as a high-definition,
high-quality inspection using full 3D-CT. In recent years, the VT-X750 has been used for inspection of solder voids and solder filling of
through-hole connectors in final assembly of power devices such as IGBTs and MOSFETs, which are essential for EVs, as well as
Integrated machine and electric power. It has also been widely utilized in the fields of aerospace, industrial equipment, and
semiconductors.
The VT-X750 improves upon previous Omron 3D-CT technology making it the fastest X-Ray inspection system to date *¹.
The automated inspection logic has been improved for many parts such as IC heal fillets, stacked devices (PoP), through hole
components, press-fit connectors, and other bottom terminated parts.
Increasing automated inspection speed and expanding inspection logic enables full, in-line inspection coverage by 3D-CT
method.
BGA/CSP, inserted components, SOP, QFP, transistors, R/C chips, bottom-side terminal components, QFN, Power devices, POP, Press-fit CN, etc.
Void, open, non-wet, Solder Volume, shifting, foreign object, bridging, Solder fillet, TH Solder filling, Solder ball, etc. (selectable to applications)
high-quality inspection using full 3D-CT. In recent years, the VT-X750 has been used for inspection of solder voids and solder filling of
through-hole connectors in final assembly of power devices such as IGBTs and MOSFETs, which are essential for EVs, as well as
Integrated machine and electric power. It has also been widely utilized in the fields of aerospace, industrial equipment, and
semiconductors.
The VT-X750 improves upon previous Omron 3D-CT technology making it the fastest X-Ray inspection system to date *¹.
The automated inspection logic has been improved for many parts such as IC heal fillets, stacked devices (PoP), through hole
components, press-fit connectors, and other bottom terminated parts.
Increasing automated inspection speed and expanding inspection logic enables full, in-line inspection coverage by 3D-CT
method.
BGA/CSP, inserted components, SOP, QFP, transistors, R/C chips, bottom-side terminal components, QFN, Power devices, POP, Press-fit CN, etc.
Void, open, non-wet, Solder Volume, shifting, foreign object, bridging, Solder fillet, TH Solder filling, Solder ball, etc. (selectable to applications)
Main body：
Footprint：(W x D x H)：1550mm(W) × 1925mm(D) × 1645mm(H).
Weight(kg)：3100 kg.
Power supply：Single phase, AC 200~240V，50/60Hz.
PCBA Size：50 x 50 ～ 610 x 515 mm、Thickness 0.4 ～ 5.0mm、Weight Less than 4.0kg、Warpage Less than 2.0mm.
X-ray source：Micro-fucus closed tube.
Method：3D-slice imaging by using parallel CT.
Footprint：(W x D x H)：1550mm(W) × 1925mm(D) × 1645mm(H).
Weight(kg)：3100 kg.
Power supply：Single phase, AC 200~240V，50/60Hz.
PCBA Size：50 x 50 ～ 610 x 515 mm、Thickness 0.4 ～ 5.0mm、Weight Less than 4.0kg、Warpage Less than 2.0mm.
X-ray source：Micro-fucus closed tube.
Method：3D-slice imaging by using parallel CT.